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(The University of Southern Maine)

The University of Southern Maine (USM) is a multi-campus public urban comprehensive university and part of the University of Maine System. USM's three primary campuses are located in Portland, Gorham, and Lewiston. Originally founded as two separate universities (Gorham Normal School, University of Maine at Portland), the two state universities were combined in 1970 to help streamline the public university system in Maine and eventually expanded by adding the Lewiston campus in 1988. The Portland Campus is home to the Edmund Muskie School of Public Service along with the Bio Sciences Research Institute and the University of Maine School of Law, the Osher Lifelong Learning Institute and the Osher Map Library. The Gorham campus, much more residential, is home to the College of Education and the School of Music.

More information: http://en.wikipedia.org/wiki/University_of_Southern_Maine

Wooden Bridge Built 1881 Image Courtesy of Maine Historical Society (MM item 7943) We’re going to look now at some images of improvements and structures that Goodwin built at Deering Oaks. This is the first bridge that stretched over the westernmost arm of the pond. It was built in 1881 and was made out of wood.

Goodwin’s Plan for The Oaks 1879 Image Courtesy of DPS Engineering, City of Portland In 1879, the city finally purchased the Oaks from the Deerings, and the city engineer, William Goodwin, drew up plans for its use. His plans show much of the original pond filled in [indicate where Mill Pond would have been, near Forest Ave]. The fountain and Duck House are shown on the remainder of the pond [point out], and the anticipated bandstand is placed north of the pond connected to the large path by two footpaths [point]. This map also shows how State Street is continued through the park, rather unintentionally, bordering it on the east. The land on the other side of State Street still belongs to the tanneries in 1879.
A History of Deering Oaks in Maps

A History of Deering Oaks in Maps

Thank you for joining us today. The webinar will begin in a few moments. If you haven’t dialed into the audio (telephone) portion, please do so now…USA Toll Free Number: 1 (866) 238-1640 If you are experiencing technical problems with the GoToWebinar program, contact the GoToWebinar help desk at 1 (800) 263-6317 Webinar ID: 228229182 Today’s presentation and handouts are available for download at www.nrcoi.org (click on teleconferences then on the date on the session) Following the webinar, a playback will be available at www.nrcoi.org (click on teleconferences then on the date on the session)
Understanding and Developing Child Welfare Practice Models The Service Array Process National Child Welfare Resource Center for Organizational Improvement A Service of the Children’s Bureau, U.S.D.H.H.S. April 28, 2008

Understanding and Developing Child Welfare Practice Models The Service Array Process National Child Welfare Resource Center for Organizational Improvement A Service of the Children’s Bureau, U.S.D.H.H.S. April 28, 2008

PowerPoint Overheads to accompany Phillip E. Allen Douglas R. Holberg CMOS Analog Circuit Design Chapter 1 Introduction and Background
Micromachining of Silicon and Its Applications in MEMS and Intelligent Sensors

Micromachining of Silicon and Its Applications in MEMS and Intelligent Sensors

Mustafa G. Guvench, Ph.D. University of Southern Maine

Machining of glass filled ceramic performed on a CNC milling. The coolant, (water), is dispensed from a self devised closed loop system. By following manufacturer’s recommended head speed and feed rates with carbide tooling we achieved professional results. Molybdenum (MO) is a refractory metal can withstand operating conditions > 2000˚C, has a high watt density and is easily machined. Retention of our 0.0035” foil retaining the stock was accomplished using adhesive onto a flat laminate base. A semi-circular pattern creates controlled heated area and enables the correct resistance to be obtained. The lower right photo reveals the heated area suitable for our circular wafers. Temperature profiling of my design characterizing the operating parameters and heater capability. Two methods were utilized and compared to minimize error from thermal conduction of thermo-couple (TC) wire and/or convection from residual gas flow. The left photo has the TC bonded to wafer surface enclosed by a Pyrex Petri dish. Measurements in the right photo are taken within a pocket sandwiched between two silicon wafers. The unit is capable of operating up to 580˚C in inert gas, low pressure condition for post deposition heat treatment. Below are photos of the actual Aluminum sputtering process. We employ a DC biased magnetron head designed to capture electrons and elevate energy state amplify ionization of Argon atoms evident by the circular pattern in the left pho...

PowerPoint Overheads to accompany Phillip E. Allen Douglas R. Holberg CMOS Analog Circuit Design Chapter 7 High-Performance CMOS Op Amps

PowerPoint Overheads to accompany Phillip E. Allen Douglas R. Holberg CMOS Analog Circuit Design Chapter 8 Comparators

Student: Tho T. Snow Advisor: Prof. Mustafa G. Guvench Electrical Engineering Department - University of Southern Maine A four-quadrant Si photosensor is designed to fabricate on a 4-in n-type wafer manufactured by Fairchild Semiconductor Design, Fabrication, and Testing a Four- Quadrant Silicon Photosensor Top view of 3 masks designed for a four-quadrant Si photosensor Mask # 1 Mask #2 Mask #3 Top view of p++ active layer Metal contact Metallization three masks aligned to active layer pattern on top of each other Structural cross sectional view of a quadrant of Si photosensor device slope = 90 Picture on the left hand side is the control unit of the furnace, and the one on the right is a hot furnace tube in which the wafer is placed for oxide growth and dopant diffusion. The photo above is the vacuum chamber used in the metal deposition on the surface of the Si wafer. The metal layer on the wafer shown in the picture above was processed using this vacuum chamber The goal of this project is to design and fabricate a Si photosensor consisting of four identical photodiodes placing in a square pattern on a Si chip. The photosensor will be used to sense the 2- dimension position of the chip with respect to the spot defined by Red 632.8 nm He-Ne laser beam. The oxide thickness and the doping concentration of the Si layer un...
Copyright Notice

Copyright Notice

© 2002 Pearson Education, Inc., Upper Saddle River, NJ. All rights reserved. This material is protected under all copyright laws as they currently exist. No portion of this material may be reproduced, in any form or by any means, without permission in writing from the publisher. For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN0-201-44494-1.

PowerPoint Overheads to accompany Phillip E. Allen Douglas R. Holberg CMOS Analog Circuit Design Chapter 2 CMOS Technology

PowerPoint Overheads to accompany Phillip E. Allen Douglas R. Holberg CMOS Analog Circuit Design Chapter 4 Analog CMOS Subcircuits
Photolithographic Process

Photolithographic Process

Bulk Micromachining of Silicon for MEMS

Bulk Micromachining of Silicon for MEMS

Mustafa G. Guvench, Ph.D. University of Southern Maine

PowerPoint Overheads to accompany Phillip E. Allen Douglas R. Holberg CMOS Analog Circuit Design Chapter 10 Digital — Analog and Analog — Digital Converters
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